FIELD: radio electronic engineering. SUBSTANCE: prior to forming electric junction, rod with spherical end of radius greater than or equal to substrate thickness is set in rotary motion at peripheral velocity between 1 and 1000 rpm and vertically fed by applying force not to exceed breaking strength of substrate material. Substrate is placed on base whose hardness is equal to or several units lower than that of material of rod spherical end. In the course of manufacture of hybrid integrated circuits and printed-circuit boards exfoliation of deposited metal is practically fully eliminated because substrate does not suffer breaking forces or strain. EFFECT: improved reliability of hybrid integrated circuits and printed-circuit boards. 3 cl, 2 ex
