FIELD: electronics. SUBSTANCE: process is related to attachment of semiconductor devices to solid body, to attachment of semiconductor chips to supporting element. Supporting element for semiconductor chip 23, specifically, for assembly in chip card incorporates substrate 15, carrying chip 23 and rigidity film 10 laminated on substrate side carrying chip with recess 14 for location of chip and its leads 24 which edge is fitted with frame 12 manufactured as one unit with film 10. EFFECT: simplified process of manufacture of supporting elements for semiconductor chip. 7 cl, 5 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| NONCONDUCTING SUBSTRATE FORMING BAND OR UNIT OF USE MOUNTING PLURALITY OF BEARING MEMBERS | 1997 |
|
RU2202126C2 |
| INTEGRATED CIRCUIT MODULE | 1996 |
|
RU2173476C2 |
| CARD HAVING BUILT-IN IC-CHIP AND SEMICONDUCTOR IC-CHIP USABLE WITH THE CARD | 1997 |
|
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|
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| CARD WITH BUILT-IN INTEGRATED CIRCUIT AND ITS MANUFACTURING PROCESS | 1997 |
|
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| INTEGRATED-CIRCUIT CARD MODULE | 1997 |
|
RU2189635C2 |
| INTEGRAL CIRCUIT ASSEMBLY | 1996 |
|
RU2145732C1 |
| ADHESIVE JOINT | 1998 |
|
RU2180138C2 |
| CARRYING MEMBER FOR SEMICONDUCTOR CHIP DESIGNED FOR BUILDING INTO INTEGRATED-CIRCUIT CARD | 1998 |
|
RU2216042C2 |
| CARD WITH BUILT-IN MICROPROCESSOR | 1997 |
|
RU2189634C2 |
