FIELD: electronic engineering. SUBSTANCE: proposed terminal strip of desired thickness is made of material ensuring adequate conductivity and soldering ability and incorporates internal and external terminals of adequate design and size. EFFECT: enhanced power characteristics due to reduced microwave signal energy loss. 5 cl, 1 dwg
Title | Year | Author | Number |
---|---|---|---|
LEAD FRAME FOR SHF AND EHF SEMICONDUCTOR DEVICE | 2011 |
|
RU2456703C1 |
MULTIPLE-LAYER CHIP FOR MICROWAVE AND SHORT- WAVE RANGE | 1992 |
|
RU2088057C1 |
LEAD FRAME FOR MULTICHIP SEMICONDUCTOR MICROWAVE DEVICE | 2013 |
|
RU2541725C1 |
LEAD FRAME MANUFACTURING PROCESS | 2000 |
|
RU2183366C2 |
MICROWAVE INTEGRATED-CIRCUIT CASE | 1992 |
|
RU2079931C1 |
MULTILAYER HYBRID INTEGRATED S H F CIRCUIT | 1992 |
|
RU2071646C1 |
HYBRID INTEGRAL VACUUM MICROSTRIP DEVICE | 1994 |
|
RU2073936C1 |
HYBRID INTEGRATED CIRCUIT OF SHF RANGE | 2010 |
|
RU2450388C1 |
METHOD FOR PRODUCING MICROWAVE HYBRID INTEGRATED CIRCUIT | 2006 |
|
RU2314595C2 |
METHOD TO MAKE HYBRID INTEGRAL CIRCUIT OF MICROWAVE BAND | 2009 |
|
RU2417480C1 |
Authors
Dates
2002-10-20—Published
2000-04-17—Filed