FIELD: electrical engineering; piezoelectric resonators for various radio-electronic devices and domestic appliances. SUBSTANCE: method includes cutting crystals into sections and blanks, grinding blanks through thickness, assembling blanks into stack by means of adhesive, and cutting stack of blanks into wafer stacks, grinding wafer stacks on length, cutting wafer stack into stacks of individual crystal elements, their grinding through width, producing two pairs of working electrodes on pre-cleaned surfaces of individual crystal elements, soldering o taps, and also assembling resonator modules, frequency tuning, resonator sealing, parameter check-up, and testing; upon grinding wafer stacks through their length; large edge of each wafer is polished, metal is chemically sprayed onto polished surfaces followed by deposition of first pair of working electrodes onto large edges of each wafer, these procedures being followed by deposition of second pair of working electrodes onto individual crystal elements after their grinding through width and polishing their edges. EFFECT: enhanced quality of microresonators. 12 dwg
Title | Year | Author | Number |
---|---|---|---|
TORSIONAL VIBRATOR | 2000 |
|
RU2187882C1 |
CRYSTAL RESONATOR MANUFACTURING PROCESS | 1999 |
|
RU2169986C2 |
STRIP PIEZOELEMENT OF THICKNESS-SHEAR MODES AND PROCESS OF ITS MANUFACTURE | 1992 |
|
RU2007023C1 |
METHOD TO MANUFACTURE QUARTZ CRYSTALLINE ELEMENTS OF Z-SECTION | 2012 |
|
RU2475950C1 |
PIEZOELECTRIC CAVITY | 1992 |
|
RU2047267C1 |
HIGH-FREQUENCY PIEZOID | 2003 |
|
RU2234186C1 |
PIEZOELECTRIC CONVERTER AND PROCESS OF ITS MANUFACTURE | 1997 |
|
RU2121241C1 |
METHOD TO MANUFACTURE PIEZOELEMENTS FOR HIGH-FREQUENCY RESONATORS | 2010 |
|
RU2458458C2 |
MANUFACTURING METHOD OF QUARTZ CRYSTAL ELEMENTS FOR PIEZO-DEVICES WITH PIEZOELECTRIC VIBRATORS OF CUTS OF yx1/+45° AND yx1/-45° | 2009 |
|
RU2397605C1 |
PIEZOELECTRIC RESONATOR | 1994 |
|
RU2107987C1 |
Authors
Dates
2002-11-20—Published
2001-02-09—Filed