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2 194 597

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C1

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IPC

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Application

2001120198/02, 2001-07-18

(24)

Start date

2001-07-18

(22)

Actual filing date

2001-07-18

(45)

Published

2002-12-20

(72)

Inventor

Zenin V.V.Segal Ju.E.Beljaev V.N.

(73)

Holder

Voronezhskij Gosudarstvennyj Tekhnicheskij UniversitetOoo Konsul'Tatsionno-Tekhnicheskij Tsentr

METHOD FOR PREPARING ARTICLES WITH SILVER COATING FOR SOLDERING Russian patent published in 2002 - IPC

Abstract RU 2194597 C1

FIELD: microelectronics, namely preparation of copper bodies of transistors with silver coating before soldering semiconductor crystals. SUBSTANCE: method comprises steps of removing sulphide film Ag2S before soldering at annealing in oxygen at temperature (250-350)C for (15 -45) min. EFFECT: simplified preparation process, enhanced quality of cleaning surface, improved quality of soldered joints. 1 ex

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RU 2 194 597 C1

Authors

Zenin V.V.

Segal Ju.E.

Beljaev V.N.

Dates

2002-12-20—Published

2001-07-18—Filed

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