METHOD FOR MANUFACTURING TAB CONNECTORS ON SEMICONDUCTOR CHIP Russian patent published in 2003 - IPC

FIELD: manufacture of semiconductor devices. SUBSTANCE: method included dropping of wire made of solder material onto contact pads of chip heated to temperature higher than solder melting point and held thereon until wire bottom part melts to form ball. Novelty is that wire sections made of solder material, each being equal in size to volume of tab connection, are aligned with contact pads of chip through taper holes in wafer tightly fitted to chip, taper angle in hole being equal to angle at which solder is wetting contact-pad metal; after that chip is heated to solder melting point. Proposed procedure provides for making tab connections equal in shape and volume and for producing tab connections on contact pads of chips as part of wafer. EFFECT: facilitated manufacture. 1 cl, 2 dwg