FIELD: metallurgy.
SUBSTANCE: solder contains components in following ratio, wt %: tin 87.0-89.0; bismuth 9.0-11.0; stibium 0.8-1.2. Solder allows well technological properties, particularly, it allows high coefficient of conduction and well wettability of soldered coatings of crystal and basis of body.
EFFECT: reliability improvement of semiconductor power devices ensured by increasing of durability of soldered joints at thermocycling.
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SU1673351A1 |
