FIELD: manufacture of solid-state semiconductor devices. SUBSTANCE: substrate has ceramic wafer and aluminum pattern of circuit made of aluminum or aluminum alloy and connected to mentioned substrate by means of layer incorporating in its composition Al and Cu. Its manufacturing process includes disposition of binding alloy Al-Cu between aluminum pattern of circuit and wafer and heating of assembly obtained at definite temperature and pressure. Substrate produced in the process is distinguished by good heat-transfer characteristics and minimal number of cracks on soldered joints and on substrate proper. EFFECT: reduced mass and cost, enhanced quality of substrate. 18 cl, 1 dwg, 12 tbl, 25 ex
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