WAFERS (VERSIONS) Russian patent published in 2003 - IPC

FIELD: confectionery industry. SUBSTANCE: wafers contain wafer sheets with filling placed between them and they are coated with glaze. Preliminarily tempered at temperature 40-45 C, glaze for wafers preparation contains, according to versions 1-3, sugar power, cacao powder, fat-replacer of cacao butter "Kuva-500R", soya phosphatide concentrate, vanillin, while, according to version 4, mixture additionally contains dry fat-free milk. According to version 1, mixture for preparation of wafers filling contains sugar powder, ground roasted peanut, dry fat-free milk, cooking fat, flavor "Lesnoy orekh" (Hazel nut), wafer crumbles, and, according to versions 2 and 3, mixture contains sugar powder, roasted ground peanut, dry fat-free milk, cooking fat, wafer crumbles, while, according to version 2, mixture also includes flavor "Vanilny", and, according to version 3, flavor "Slivki" (Cream). According to version 4, filling may contain sugar powder, cacao powder, roasted ground peanut, dry fat-free milk, wafer crumbles, cooking or confectionery fat, flavor "Lesnoy orekh" or "Slivki" or "Vanilny". Components are used in preset ratio. EFFECT: original taste due to synergism of ingredients; increased storage life. 7 cl, 6 ex