METHOD FOR APPLYING SOLDER ONTO STRUCTURE Russian patent published in 2003 - IPC

Abstract RU 2205729 C2

FIELD: manufacture of constructions having tubular casing and honeycomb member. SUBSTANCE: method comprises steps of forming honeycomb member by collecting to pack and(or) coiling metallic sheets among which at least part of sheets are structured in order to form ducts for passing fluid; partially inserting honeycomb member to tubular casing; providing contact of end part of portion extending out of tubular casing with roller containing adhesive composition; providing relative motion of honeycomb member and roller; then finally introducing honeycomb member to tubular casing and placing solder onto it. EFFECT: simplified low-cost process for applying solder before soldering structure. 17 cl, 10 dwg

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RU 2 205 729 C2

Authors

Vires Ljudvig

Kurt Ferdi

Dates

2003-06-10Published

1999-01-21Filed