METHOD FOR PRODUCING MICROSTRIP BOARDS FOR HYBRID INTEGRATED CIRCUITS Russian patent published in 2003 - IPC

FIELD: electronic engineering. SUBSTANCE: in manufacturing microstrip boards conducting film, 2-20 mcm thick, is evaporated and anticorrosive coating is applied in two steps using shielding mask; during first step conductors and resistors are covered with insulating film and during second step metal-barrier and anticorrosive metal coatings are applied to contact pads, ground-shield metal-plated surfaces, and auxiliary conductors. EFFECT: improved performance characteristics due to reduced loss in microstrip lines; reduced noble metal consumption. 3 cl