FIELD: electronic engineering. SUBSTANCE: case-cover is made of insulating material and has flat bottom and side walls; joints between bottom and side walls as well as wall-to-wall joints have rectangular edges on external end and are rounded off on internal one. Case-cover thickness H at these joints meets relation H > 1.4d, where d is thickness of case-cover bottom and side walls. EFFECT: improved power characteristics of integrated circuit; reduced cost of case-cover. 4 cl, 2 dwg
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