PRINTED-CIRCUIT BOARD MANUFACTURING PROCESS Russian patent published in 2003 - IPC

FIELD: electrical engineering; printed-circuit boards for radio equipment in aircraft and space engineering. SUBSTANCE: process includes selective etching of separate sections on metal (for instance copper) foil stuck to insulating backing, evaporation of conducting pattern and radio circuit, galvanic plating of resistive coating of tin-lead or tin-bismuth alloy or tinning with easy- melting Wood alloy, and vacuum heat treatment at temperature of 80-160 C and residual pressure of 1•10^-1-1•10^-2 mm Hg for 20-60 min. EFFECT: enhanced service life of radio circuits. 1 cl, 5 ex