COMPOSITION MATERIAL Russian patent published in 2003 - IPC

FIELD: powder metallurgy, namely production of composition material that may be used, for example in semiconductor devices. SUBSTANCE: composition material including metal and inorganic particles having thermal expansion factor less than that of used metal and dispersed in metal in such a way that at least 95% of particles (according to their area in cross section) form mutually joined complex-shape aggregates. Material contains no more than 100 separate inorganic particles per 100 sq.micrometers of its cross section area. In temperature range 20 -150 C thermal expansion factor of material increases in average by (0,025-0,035)×10^-6/^°C at change of heat conductivity at 20C by 1Wt/(m x K). Such material may include copper and copper oxide particles. EFFECT: material having low thermal expansion factor and high heat conductivity and easily subjected to plastic working. 5 cl, 21 dwg, 4 tbl, 11 ex