FIELD: electronics. SUBSTANCE: invention refers to process of manufacture of insulation substrate that ensures insulation inside case of high-power semiconductor device, for instance. Present invention makes provision for process of manufacture of insulation printed- circuit board which includes application of voltage between relief of printed-circuit board in atmospheric air or in gas with reduced pressure to ensure electric discharge across printed circuit board or its irradiation with laser beam. As result protrusions of end part of electrode conductor melt and smooth to limit concentration of electric field. Technical result of invention lies in limited local concentration of electric field in end part of layer of conductor in insulation printed circuit board and in increased initial voltage of partial electric discharge which leads to improved insulation reliability of insulation printed circuit board and of high-power semiconductor device employing it. EFFECT: improved insulation reliability of insulation printed circuit board and of high-power semiconductor device employing it. 18 cl, 13 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| COMPOSITE MATERIAL, PROCESS OF ITS PRODUCTION, PANEL OF SEMICONDUCTOR DEVICE EMITTING HEAT, SEMICONDUCTOR DEVICE ( VARIANTS ), DIELECTRIC PANEL AND ELECTROSTATIC ABSORBING FACILITY | 2000 |
|
RU2198949C2 |
| SEMICONDUCTOR DEVICE | 1999 |
|
RU2165115C2 |
| COMPOSITION MATERIAL | 1998 |
|
RU2216602C2 |
| SEMICONDUCTOR MEMORY DEVICE | 1999 |
|
RU2249262C2 |
| SEMICONDUCTOR STORAGE | 1998 |
|
RU2216819C2 |
| CERIUM OXIDE ABRASIVE AND SUBSTRATE POLISHING TECHNIQUE | 1997 |
|
RU2178599C2 |
| CARRYING MEMBER FOR SEMICONDUCTOR INTEGRATED CIRCUIT | 1997 |
|
RU2156521C2 |
| PLASMA TREATMENT DEVICE | 2008 |
|
RU2420044C2 |
| METHOD AND DEVICE OF CONNECTING CHIP TO PRINTED CONDUCTIVE SURFACE | 2010 |
|
RU2563971C2 |
| METHOD FOR REJECTION TESTS OF LAYOUT-BEARING INSULATION OR SEMICONDUCTOR SUBSTRATE AND ELECTRONIC DEVICES FOR EXTERNAL EFFECTS | 1998 |
|
RU2138830C1 |
