FIELD: power electronics.
SUBSTANCE: at least one semiconductor chip 4 brought in contact by applying certain pressure is electrically connected through contact member 8 to one main lead 30. Contact member 8 has two flat contact surfaces 81, 82 with spring member 7 in-between. Equal contacting force is ensured by respective spring member 7 irrespective of position and height of separate chips 4. Supporting member 10 prevents mechanical overloads on semiconductor chips 4 when module is compressed. Such design of semiconductor module ensures that all semiconductor chips are held at equal pressure irrespective of their distance to second main lead.
EFFECT: improved conductivity of means meant for contacting.
8 cl, 2 dwg
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Authors
Dates
2004-12-27—Published
2000-01-26—Filed