FIELD: semiconductors.
SUBSTANCE: in a powerful semiconductor device, crystal producing heat is mounted by metallic contact zones of face side on appropriately metal-covered lower heat drain with use of heat-conductive layer, and all contact areas of crystal are resiliently pressed to upper and lower heat-drains by its pressurizing lid. Heat drain from active crystal is performed from its face and check sides, while from face side with use of heat-conductive layer placed between active zone of crystal face side and lower heat drain, and body pressurization and resilient compression of crystal to metal-covered contact zones of body are realized by heat-draining lid of body.
EFFECT: better overall parameters, higher reliability, simplified construction.
5 dwg
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Authors
Dates
2005-06-10—Published
2003-03-21—Filed