SOLDER FOR TINNING ALUMINIUM FILM ON SILICON Russian patent published in 2013 - IPC B23K35/26 

Abstract RU 2477206 C1

FIELD: process engineering.

SUBSTANCE: invention may be used in production of electronic hardware, particularly, for tinning aluminium film surface on solid-state and dielectric substrates. Solder contains components in the following ratio in wt %: strontium - 0.1-2.0, tin making the rest.

EFFECT: better spread, higher adhesion.

2 dwg, 1 tbl

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RU 2 477 206 C1

Authors

Sozaev Viktor Adygeevich

Ponezhev Murat Khazhismelovich

Kashezhev Aslan Zarifovich

Manukjants Artur Rubenovich

Elekoeva Kristina Muratovna

Prokhorenko Andrej Dmitrievich

Dates

2013-03-10Published

2011-08-03Filed