FIELD: process engineering.
SUBSTANCE: invention may be used in production of electronic hardware, particularly, for tinning aluminium film surface on solid-state and dielectric substrates. Solder contains components in the following ratio in wt %: strontium - 0.1-2.0, tin making the rest.
EFFECT: better spread, higher adhesion.
2 dwg, 1 tbl
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Authors
Dates
2013-03-10—Published
2011-08-03—Filed