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2 477 207

(13)

(51)

IPC

B23K35/26(2006-01-01)

C22C12/00(2006-01-01)

(21) (22)

Application

2011133402/02, 2011-08-09

(24)

Start date

2011-08-09

(22)

Actual filing date

2011-08-09

(45)

Published

2013-03-10

(72)

Inventor

Tregubov Vladislav AlekseevichLopatina Elena StepanovnaBatalova Elena IvanovnaNovikova Ljudmila Grigor'Evna

(73)

Holder

Otkrytoe Aktsionernoe Obshchestvo Institut Priborostroenija Imeni V.V. Tikhomirova"

LEAD-FREE SOLDER Russian patent published in 2013 - IPC B23K35/26 C22C12/00

Abstract RU 2477207 C1

FIELD: process engineering.

SUBSTANCE: invention may be used in microelectronics, particularly, for soldering and tinning components of radio electronic hardware. Lead-free solder comprises the following components in the following ratio, in wt %: bismuth - 69-72, indium - 29-32.

EFFECT: better fluidity and adhesion to soldered material.

2 tbl

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RU 2 477 207 C1

Authors

Tregubov Vladislav Alekseevich

Lopatina Elena Stepanovna

Batalova Elena Ivanovna

Novikova Ljudmila Grigor'Evna

Dates

2013-03-10—Published

2011-08-09—Filed