FIELD: heat transfer devices for electronic equipment and their manufacturing process.
SUBSTANCE: proposed heat transfer device depending for its operation on heat dissipation has anisotropic carbon enclosed in encapsulating material to enhance strength of device accommodating anisotropic carbon. Encapsulating material may be polyamide, or epoxy resin, or polyacrylate, or ester, or other suitable polymer.
EFFECT: enhanced heat conductance at reduced mass and size.
67 cl, 14 dwg
