FIELD: UHF electronics.
SUBSTANCE: active components are mounted with their face sides directed towards dielectric board, and board itself is also mounted on metallic base with its face directed to the latter. In places of connection linking elements are made, and heat is drained from active components of metallic columns with section and height of 40-50 mcm.
EFFECT: higher manufacturability, higher reliability, lower costs.
2 cl, 1 dwg, 1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| INTEGRATED MICROWAVE CIRCUIT | 2011 |
|
RU2474921C1 |
| MICROWAVE INTEGRATED CIRCUIT | 2013 |
|
RU2556271C1 |
| MICROWAVE INTEGRATED CIRCUIT | 2017 |
|
RU2654970C1 |
| INTEGRATED UHF CIRCUIT | 2020 |
|
RU2737342C1 |
| MICROWAVE INTEGRATED CIRCUIT | 1994 |
|
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| THE ELECTRONIC MICROWAVE FREQUENCY DEVICE | 2010 |
|
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|
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|
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|
RU2657336C1 |
| HYBRID INTEGRATED CIRCUIT OF SHF RANGE | 2010 |
|
RU2450388C1 |
