TRANSCEIVING MODULE OF ACTIVE PHASED ANTENNA ARRAY Russian patent published in 2018 - IPC H01Q21/00 

FIELD: antenna equipment.

SUBSTANCE: transceiver module of an active phased array antenna is provided, comprising at least four single-channel modules, each of them comprises a series-connected security device and a low-noise amplifier of the receiving channel, an output power amplifier of the transmission channel, two receive / transmit switches, a bi-directional phase shifter, a control circuit, electrical communication and power elements, two outputs – the first and second, wherein said electronic components of each of the four single-channel modules are made in the form of at least three fragments, each of the different electronic components defined on the composition on a separate dielectric substrate, wherein said fragments with the same electronic components are located on one of at least one of the components, three levels-the first, second, third, respectively, the levels are interconnected by at least three interconnection-separating elements, in each of them four cavities are made in the center of the quadrants mirror-symmetrical with respect to two mutually perpendicular planes passing through the longitudinal axis of the module, a configuration that repeats the said quadrant, at that the first level, there are an output power amplifier of the transmission channel, a second receive / transmit switch, the contact of the first receive / transmit switch K1 is connected through a bi-directional phase shifter with a first terminal, its contact in the transmission position K2 is connected to the input of the output power amplifier of the transmission channel, the output of the latter – with the contact of the second switch receiving / transmitting K2, its contact K1 – with the second terminal, the contact of the second switch receiving / transmitting K3 – with the input of the protective device, the output of the latter – with the input of the low-noise amplifier of the receiving channel, its output – with the contact of the first switch receiving / transmitting K3, electrical communication between the electronic components of the fragments and each level is provided by the communication elements, the transceiver module having a body, the base, the walls and the cover of which are connected to provide tightness. In this case, the individual dielectric substrates of each said fragment and each level are made of diamond, wherein each said fragment being formed on the front side of each said individual dielectric substrate of diamond, on the back side thereof a metallization coating, in its volume – metallized grounding holes, at the first level a protective device and a low-noise amplifier of the receiving channel are additionally made, on the second – the first switch reception / transmission, the bidirectional phase shifter, on the third – the control circuit, the electric communication and power supply elements, and the electrical connection between the electronic components of said fragments and each level is provided by shielded coplanar line segments and planar conductors, connecting-separating element of each level is made in the form of a square plate with a side equal to wavelength λ, height – 2–3 mm, made of metal or its alloy having a high thermal conductivity and providing a consistent temperature coefficient of linear expansion with each dielectric substrate of diamond, at the same time, which is the base of each level, the base of the first level is the base of the transceiver module, the side walls of the base of each level form the outer wall of the transceiver module housing, and the four cavities of each level are made on the front side of the base with a depth of 1–1.5 mm, a wall thickness of 1.5–2 mm, the latter forming the inner walls of the housing of the corresponding level of the transceiver module, the central opening is coaxial at the base of the second, third level and the housing cover, symmetrically with respect to two mutually perpendicular planes passing through the longitudinal axis of the module, and which is buried in the base of the first level by 1–1.5 mm, on the front side of the base of each level, four grooves are made by the shortest path along the bisector of the quadrant passing through the longitudinal axis of the module, 1–1.5 mm in depth and width, respectively, providing the connection of four cavities of each level with the central hole for the subsequent sealing of the transceiver module, the back side of the base of each level is made flat, on the reverse side of the base of the first level, a second terminal is made for connection to the output of the flat antenna array, the housing cover is made 1–1.5 mm high, commensurate with the base of the transceiver module housing, the base, walls and cover of the transceiver module are connected together tightly along their perimeter by soldering.

EFFECT: increase of output power, efficiency, reliability and durability, stability in time and repeatability of amplitude and phase characteristics, reduction of weight and size characteristics.

1 cl, 2 dwg