FIELD: cryoelectronics.
SUBSTANCE: proposed method used in manufacturing thick-film high-temperature superconductor circuit includes low-temperature firing of substrate followed by laser milling of grooves for paste and scanning with laser beam of area 
, where Sm is laser beam area in groove milling; Tev and Tmlt are material evaporation and substrate melting temperatures, respectively. Proposed method is characterized in maximal firing temperature reduced from 1600-1700 to 100-1100°C and, consequently, in reduced time, as well as in using laser packing of surface instead of high-temperature firing stage.
EFFECT: enhanced productivity, reduced power requirement.
1 cl, 2 dwg
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