METHOD FOR FORMING THREE-DIMENSIONAL THICK-FILM CIRCUIT Russian patent published in 2005 - IPC

Abstract RU 2254695 C1

FIELD: electric engineering.

SUBSTANCE: paste of increased viscosity, containing 3-5% of organic linking agent, is applied to grooves at surfaces of substrate, held by film cover and burned in during one cycle.

EFFECT: higher precision, lower costs.

4 dwg

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RU 2 254 695 C1

Authors

Buev A.R.

Igumnov V.N.

Ivanov V.V.

Dates

2005-06-20—Published

2003-09-18—Filed