FIELD: various-destination adhesives.
SUBSTANCE: strengthening glue connection of nonmetallic element with metallic element is characterized by using, as glue, polysiloxane sealant prepared from α,ω-dioxypolydimethylsiloxane, inorganic filler, polyethyl(hydride)siloxane, and organotin catalyst bases on diethylcaprylate-tin in oligoethylsiloxane. Glue connection is subjected to heat treatment at 100-300°C for 0.1-2.0 h.
EFFECT: increased heat resistance of glue connection due to heat treatment of cold-cure adhesive.
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Authors
Dates
2006-02-20—Published
2004-11-23—Filed