SEMICONDUCTOR WAFER TREATMENT DEVICE Russian patent published in 2006 - IPC H01L21/302 

FIELD: treatment of semiconductor wafer surfaces, such as their chemical and mechanical polishing followed by washing them.

SUBSTANCE: proposed device has chemical-mechanical polishing mechanism, vertical displacement mechanism with magazine holder installed for step-by-step vertical displacement of magazines, robot-manipulator provided with wafer grip, two wafer transfer robots, and wafer washing plant. Magazine holder of vertical displacement mechanism is made in the form of hollow shaft mounted on top end of spline shaft for its turning through 360 deg. from drive; bottom end of hollow shaft mounts n magazine intake platforms, where 1 < n ≤ 4; axes of magazine intake platforms are spaced 90 deg. apart and bottom ends of intake platforms carry guides with slots similar to and coaxial with magazine slots. Magazine holder is installed in detergent tank; wafer grip of robot-manipulator is made in the form of removable ring whose top part is beveled to receive wafers and spring-loaded restricting pins. Wafer grip of robot-manipulator is provided with spray nozzles installed on top and below the ring.

EFFECT: reduced labor consumption for device manufacture due to its reduced size.

1 cl, 3 dwg