FIELD: electric engineering, possible use for selecting semiconductor devices with increased reliability from a batch.
SUBSTANCE: method includes performing measurement of transfer characteristics of devices in direct current range 1-110 mA, thrice: before, after effect of 5-15 electrostatic discharges in direct and reverse direction on each transfer by voltage, equal to allowed value in accordance to technical conditions, and after thermal annealing during 4-8 hours. Temperature of annealing is calculated from formula Tann=Tall+RT·P, where Tann and Tall - temperatures of annealing and maximal allowed by technical conditions respectively, RT - thermal resistance crystal-body, P - extreme device power allowed by technological conditions. On basis of three values of m-characteristics satisfying the formula, 1≤m≤A, selection of devices is performed. Value A is set on basis of statistics on representing selection for each type of device.
EFFECT: expanded functional capabilities.
1 tbl
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Authors
Dates
2006-05-10—Published
2004-10-06—Filed