FIELD: physics.
SUBSTANCE: system of bridge interconnections of integrated circuits includes a first chip and a second chip provided in an adjacent configuration and electrically connected to each other by a bridge chip. The bridge chip has through-holes through silicon for connecting conducting lines of interconnections on the bridge chip with the first chip and the second chip. Active circuits, other than interconnection lines, may be provided on the bridge chip. At least one or more additional chips can be stacked on the bridge chip and connected to the bridge chip.
EFFECT: simple wiring process, reduced expenses on interconnection materials and providing connection between microchips with smaller spacing than usually allowed in chip and wire and equivalent interconnections with beam leads.
18 cl, 6 dwg
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