MICROWAVE HYBRID INTEGRATED CIRCUIT Russian patent published in 2006 - IPC H01L25/16 

FIELD: electronic engineering; microwave hybrid integrated circuits.

SUBSTANCE: proposed microwave hybrid integrated circuit has hole in heat-transfer metal base directly under insulating substrate hole, its sectional area being commensurable with the latter hole, which accommodates part of heat-transfer metal insert; the latter is connected to side surfaces of insulating substrate holes and to heat-transfer metal base; clearance between them is smaller than or equal to 0.4 mm and height of heat-transfer metal insert is smaller than or equal to total thickness of heat-transfer metal base and insulating substrate by height of semiconductor device chip.

EFFECT: enhanced reliability due to higher mechanical strength of connections and better heat transfer from semiconductor device chip.

2 cl, 2 dwg