FIELD: the invention refers to measuring technique of thermal parameters of power semi-conductive devices fulfilled in a body and may be used for quality control.
SUBSTANCE: the technical result is in possibility of definition of thermal resistance transition-body of thyristors and symistors, more simple realization of sources of heating and measuring currents, simplification of the processing of measuring results. The essence is in that constant measuring current Imeasure of a given value is passed through a tested device. In the initial thermodynamic balance in a moment of time t0 the values of the thermo-sensitive parameter uhc(t0)and the temperature of the body TC(t0) are measured and stored. From the moment of time t1 to the moment of time t2 the device is heated by the current iheat of arbitrary shape. During the heating process in the moments of time of n interval of measuring and storing of the thermo-sensitive parameter the values of the current are measured and stored, an average power of n interval of measuring of losses is calculated. From the moment of the time t1 the value of the heating current iheat is increased from minimal equal to the value of the constant measuring current Imeasure, and at comparison of the value of the calculated average power of losses on n interval of measuring with preliminary installed maximally feasible power Pmax it is necessary to stop increasing of the value of the heating current iheat continuing the heating process. In the moment of time t2 the passing of the heating current iheat is interrupted and the values of the thermo-sensitive parameter Uhc(t2) from passing of constant measuring currentImeasure andof the temperature of the body TC(t2) is measured and stored. After the moment of time t2 in the regime of natural cooling till achieving the hydrodynamic balance in the moment of time t3 the values of the thermo-sensitive parameter Uhc(t3) and the temperature of the body TC(t3)are measured and stored and thermal resistance of transition-body is calculated.
EFFECT: creates effective and convenient mode of diagnostics.
1 dwg
Authors
Dates
2007-05-27—Published
2006-02-02—Filed