FIELD: measuring equipment.
SUBSTANCE: invention relates to measurement of thermal parameters of power electronics components and can be used to determine transient thermal resistance of crystal-housing ZThJC (t) and heat resistance of crystal-housing in state of thermal equilibrium of RThJC transistors with field control, in particular, bipolar transistors with insulated gate (IGBT) and field-effect transistors with isolated gate (MOSFET) to control their quality. According to the disclosed method, the tested transistor is heated by direct current with the condition that a known constant power is detected in the transistor structure. On the heating interval, temperature dependences of the housing and the temperature sensitive parameter are obtained from the heating time, wherein the temperature sensitive parameter is voltage at the gate of the tested transistor. Heating is stopped when the preset temperature of the housing is reached. After a time interval of at least 2τ, where τ is a crystal-housing thermal constant value, at the natural cooling interval, periodic measuring pulses of electric current are periodically transmitted through the structure of the transistor under the condition that constant power is selected in the transistor structure, which is equal to the constant power value allocated in the transistor structure on the heating interval, duration and porosity of which minimally affect thermal processes. During each measurement pulse of electric current simultaneous measurement and storage of housing temperature and temperature-sensitive parameter. Method includes finding function of interrelation of crystal temperature and temperature-sensitive parameter and calculating transient thermal resistance of chip-housing ZThJC(t), determining the thermal resistance of the crystal-housing in the thermal equilibrium state RThJC of the tested transistor equal to the value ZThJC(t) at the constant section.
EFFECT: high accuracy of determining transient thermal resistance of the crystal-housing ZThJC(t) and thermal resistance of the crystal-housing in a state of thermal equilibrium of RThJC transistors with field control.
1 cl, 2 dwg
Title | Year | Author | Number |
---|---|---|---|
METHOD FOR AUTOMATED MONITORING OF THERMAL RESISTANCES OF SEMICONDUCTOR DEVICES | 2018 |
|
RU2698512C1 |
METHOD OF MEASURING THERMAL RESISTANCE OF TRANSITION-CASE OF POWER SEMICONDUCTOR DEVICES | 2019 |
|
RU2724148C1 |
METHOD FOR DETERMINATION OF THERMAL RESISTANCE FOR JUNCTION FIELD-EFFECT TRANSISTORS | 2012 |
|
RU2516609C2 |
METHOD OF AUTOMATED DETERMINATION OF THERMAL RESISTANCE TRANSITION - BODY OF PACKED POWER SEMICONDUCTOR DEVICES | 2017 |
|
RU2653962C1 |
MODE OF DEFINITION OF THERMAL RESISTANCE TRANSITION-BODY OF POWER OF SEMI-CONDUCTIVE DEVICES FULFILLED IN A BODY | 2006 |
|
RU2300115C1 |
EXPRESS METHOD FOR MEASURING BODY TRANSFER HEAT RESISTANCE OF POWER SEMICONDUCTOR DEVICES | 2003 |
|
RU2240573C1 |
METHOD TO MEASURE THERMAL JUNCTION-TO-CASE RESISTANCE OF HIGH-CAPACITY MIS TRANSISTORS | 2014 |
|
RU2572794C1 |
METHOD OF MEASURING COMPONENT OF THERMAL RESISTANCE OF POWERFUL SEMICONDUCTOR INSTRUMENTS | 2016 |
|
RU2654353C1 |
METHOD FOR MEASURING THERMAL RESISTANCE OF TRANSITION-HOUSING AND THERMAL CONSTANTS OF TRANSITION-HOUSING OF CRYSTALS OF SEMICONDUCTOR ARTICLES IN AN ELECTRONIC MODULE | 2019 |
|
RU2720185C1 |
METHOD OF DETERMINING THERMAL RESISTANCE OF DIGITAL INTEGRAL MICROCIRCUITS | 2020 |
|
RU2744716C1 |
Authors
Dates
2019-04-23—Published
2018-07-03—Filed