FIELD: microelectronics; miscellaneous integrated circuits, data storage means, and the like.
SUBSTANCE: proposed method for producing spatial three-dimensional structure includes covering substrate with one or more working layers of double- or multiple-atom compounds, irradiation of layers through mask with accelerated-particle beam to afford selective removal of definite-grade atoms from sections being irradiated, and associated conversion of material properties; in the process working layer is covered with auxiliary layer of material whose chemical affinity to atoms selectively removed from working layer is lower than that of working-layer non-removed atoms. In producing structure elements using accelerated-particle beam measures are taken to avoid effects associated with dissipation envelope formation; used as working layers are double- or multiple-atom chemical compositions whose atoms are characterized in strong chemical affinity and in ability of controlling their change due to selective removal of atoms by means of accelerated-particle beams.
EFFECT: more compact disposition of structure components, enlarged range of chemical compositions used as working layers.
3 cl, 5 dwg, 1 tbl, 4 ex
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Authors
Dates
2007-06-27—Published
2006-02-16—Filed