FIELD: production of semiconductor devices.
SUBSTANCE: proposed method that can be used in assembling semiconductor devices for lead-free resistance-reactance soldering of semiconductor silicon chips to package includes coating surfaces of chip and package to be soldered with aluminum and tin, respectively, and soldering them to package base. Zinc foil is disposed between chip and package and soldering is conducted at temperature of 382-419 °C.
EFFECT: ability of dispensing with lead in soldering, reduced manufacturing cost, enhanced reliability of soldered joints, facilitated manufacture.
1 cl, 2 dwg
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SU1260124A1 |
