METHOD FOR LASER DEPOSITION OF COPPER FROM ELECTROLYTE SOLUTION ON SURFACE OF DIELECTRIC Russian patent published in 2008 - IPC H05K3/00 

FIELD: electrical engineering, namely processes for localized application of metallic layers or structures on surface of different type dielectric materials for producing parts or devices of microelectronics.

SUBSTANCE: method for laser deposition of copper from electrolyte solution on surface of dielectric part provides possibility for laser deposition of copper on dielectric surface during one scanning operation due to change of copper deposition geometry and due to heating electrolyte. Usage of copper dichloride in electrolyte solution and increased temperature of electrolyte solution allow decrease threshold power of laser while lowered power of laser and focusing of laser beam onto interface substrate-electrolyte at side of substrate provides lowered influence of bubble formation process upon metallic structures deposited on surface of dielectric part. Operational modes of laser scanning are given in specification.

EFFECT: accelerated reduced-cost process of copper deposition due to lowered power consumption of the whole process.

1 cl, 4 dwg