METHOD FOR LASER DEPOSITION OF COPPER ONTO DIELECTRIC SURFACE Russian patent published in 2013 - IPC H05K3/00 

Abstract RU 2474095 C1

FIELD: electricity.

SUBSTANCE: electrolyte solution is prepared, a substrate is washed, laser is focused onto the border of substrate-electrolyte, and radiation is scanned on the above surface, at the same time the electrolyte solution contains 0.02 M CuCl2, 0.2 M NaOH, 0.15M sorbitol and as ligand - 0.022 M of Trilon B, which is then evaporated at the temperature of 60-80 degrees to a gel-like condition and applied onto the dielectric surface, the laser radiation capacity is selected as 500-600 mW, and speed of its displacement relative to the focus point - as 1-2.5 mcm/s.

EFFECT: improved properties of a deposited copper structure during continuous scanning with a laser beam.

3 dwg

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RU 2 474 095 C1

Authors

Kochemirovskij Vladimir Alekseevich

Logunov Lev Sergeevich

Menchikov Leonid Gennad'Evich

Safonov Sergej Vladimirovich

Stukalov Aleksandr Jur'Evich

Tumkin Il'Ja Igorevich

Dates

2013-01-27Published

2011-10-11Filed