METHOD FOR LASER DEPOSITION OF COPPER FROM ELECTROLYTE SOLUTION ONTO DIELECTRIC SURFACE Russian patent published in 2013 - IPC H05K3/00 

FIELD: chemistry.

SUBSTANCE: laser deposition of copper from an electrolyte solution onto a dielectric surface is carried out based on an electrolyte of the composition 0.01 M CuCl₂, 0.05 M NaOH, 0.03 M KNaC₄H₄O₆4H₂O in which before focusing the laser on the substrate-electrolyte boundary, a solution is further added, said solution containing xylite as a reducing agent in amount of 0.075 M, which provides concentration thereof with an oxidant of the order of 7.5-fold excess, and parabenzoquinone in amount of 3·10^-4 - 6·10^-4 M, and subsequent scanning of radiation on the dielectric surface with displacement velocity relative the focal point in the range of 0.0025-0.01 mm/sec and laser radiation power ranging from 100 mW to 1000 mW.

EFFECT: providing formation of copper precipitate with high electroconductivity by forming a dense homogeneous precipitate using a heterogeneous crystallisation mechanism during precipitation.

1 cl, 5 dwg