METHOD FOR LASER CREATION OF CONDUCTIVE COPPER STRUCTURES ON SURFACE OF DIELECTRIC Russian patent published in 2023 - IPC H05K3/18 C23C18/14 B23K26/34 

FIELD: dielectrics.

SUBSTANCE: invention relates to the technology of localized deposition of metal layers on the surface of dielectrics, in particular for the creation of conductive copper structures by laser action, and can be used to create microelectronic elements and devices. The cleaned dielectric substrate is placed on a titanium plate and its surface is structured with the formation of roughness using laser-induced microplasma. A solution containing choline chloride, tartaric acid and copper acetate is applied to the substrate. The resulting layer is covered with auxiliary glass. Laser radiation is focused onto the substrate-solution interface and exposed to near-IR radiation at a given power density and linear speed of laser radiation with movement along a selected trajectory.

EFFECT: method is characterized by the effective speed of deposition of conductive copper structures and their high quality.

1 cl, 3 dwg