METHOD FOR LASER DEPOSITION OF COPPER ON DIELECTRIC SURFACE Russian patent published in 2012 - IPC H05K3/00 

FIELD: physics.

SUBSTANCE: absence of a reducing agent in the solution enables to obtain dense high-conductivity copper precipitates formed only due to a coalescence process, which is the technical result of the invention. Electroconductivity of such precipitates is virtually the same as that of pure copper. The disclosed method for laser deposition of copper on a dielectric surface involves preparation of an electrolyte solution, washing the substrate, focusing a laser on the substrate-electrolyte boundary and scanning the radiation on said surface, wherein the electrolyte solution contains 0.02-0.03 M CuCl₂, 0.05-0.1 M NaOH, 0.020-0.022 M trilon B, the substrate is made from fibre-glass plastic FR4, and scanning is carried out at a rate of 1-2.5 mcm/s with laser radiation power of 400-800 mW.

EFFECT: design of a novel type of activated dielectric surfaces for laser-induced copper deposition, on which the substrate material also acts as a reducing agent.

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