METHOD OF LASER COPPER DEPOSITION FROM SOLUTION OF ELECTROLYTE ON DIELECTRIC SURFACE Russian patent published in 2012 - IPC H05K3/00 

FIELD: electricity.

SUBSTANCE: method of laser copper deposition from electrolyte solution on dielectric surface involves preparation of electrolyte solution, washing of substrate, laser focusing on substrate-electrolyte boundary and scanning of emission on the above surface; at that, electrolyte solution includes 0.01 M CuCl₂, 0.05 M NaOH, 0.03 M of sodium-potassium tartrate (KNaC₄H₄O₆·4H₂O), 0.075 M sorbite, parabenzokinone 5*10^-4 M; range of laser emission powers is 30 to 1000 mW, and speed of its movement relative to focus point is 0.01-0.25 mm/sec.

EFFECT: creation of laser copper deposition method from electrolyte solution on dielectric surface, in which there provided is formation of copper deposits with high conductivity owing to forming dense homogeneous deposit due to coalescent deposit formation mechanism.

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