FIELD: technological processes, mechanics.
SUBSTANCE: method of manufacture of composite part of interior finish contains flaky material that contains flexible surface layer, rigid back layer of wafer and intermediate layer, which represents foamed layer introduced between flexible surface layer and rigid layer of wafer. Sealing of form cavity for production of foamed layer is provided by application of sufficiently thick layer of flexible material of coating in the area of contact with wafer layer. Flaky material contains flexible surface layer, rigid back layer of wafer and intermediate layer, in particular, foamed layer that is introduced between flexible surface layer and rigid layer of wafer and that couples flexible surface layer and rigid layer of wafer with each other. Method includes operation of mold application, which contains the first semi-mold with preset three-dimensional configuration, and the second semi-mold with additional preset three-dimensional configuration, at that the first and the second semi-molds are arranged with the possibility of displacement in relation to each other and form the first cavity of mold in closed condition. Molding of flexible surface layer is carried out with the help of molding process with application of low pressure. Molding of rigid layer of wafer, with its back side that faces the second surface of mold. Then both semi-molds are joined together for closure of mold, with clearance that remains between surface layer on the first surface of mold and layer of wafer on the second surface of mold. Then hardened material is applied between surface layer on the first surface of mold and layer of wafer on the second surface of mold, and conditions are created for its hardening in closed position of the mold, in order to receive intermediate layer in specified clearance. At that hardened material is, in particular, foamed material, conditions of foaming of which are created in closed position of the mold. Then the mold is opened, and molded part of interior finish is taken out from it. At that back layer of wafer is molded with the help of additional method of molding with low pressure, this method of molding and method of surface layer molding with low pressure are selected, independently on each other, from the group, in which the following methods are included: sputtering method, method of reaction injection molding, method of hollow items molding by casting and slow rotation of mold, with application of liquid or powder, and also method of thermal molding.
EFFECT: reduction of production expenses, higher quality of interior finish part quality and reduction of equipment cost.
42 cl, 23 dwg
