FIELD: electricity.
SUBSTANCE: invention is attributed to electric engineering, in particular to manufacturing flexible metallised polymer film and can be used in production of flexible printed boards (FPB) used in electronic equipment manufacturing. Formation of polymer film relief surface is achieved due to presence of channels created by means of ion irradiation and chemical etching with subsequent metal layer formation by means of cathodic electrodeposition of metal in through hollow etched channels starting from one relief film surface closely contacting with self-supported metal cathode and to opposite free relief film surface where galvanic metallic layer of specified shape and thickness is formed. Film irradiation is conducted using bombarding ions with energy providing their projective run in polymeric film material that is 1.5-2 times greater than its thickness, and chemical etching of irradiated film is conducted till through hollow etched channels appear in it.
EFFECT: enhancement of FPB functionality, reliability and quality, and technological process cheapening.
8 cl, 3 dwg, 2 ex
