LEAD-FREE SOLDER, METHOD OF ITS MANUFACTURING AND SOLDERING METHOD WITH USAGE OF THIS SOLDER Russian patent published in 2009 - IPC C22C13/00 B23K35/26 B23K35/40 B23K1/00 

FIELD: metallurgy.

SUBSTANCE: invention can be used for manufacturing of common solders, containing lead, widespread in fields of technique related to preparation of circuit board. Lead-free solder consists components in a following ratio, wt %: roughly 96.8-99.3 of tin, roughly 0.2-3.0 of copper, roughly 0.02-0.12 of silicon optional roughly 0.005-0.01 of phosphorus and/or 0.005-0.01 of germanium.

EFFECT: improvement of properties and functional qualities of alloy, particularly increases tensile strength after aging.

24 cl, 14 dwg