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2 268 126

(13)

(51)

IPC

B23K35/26(2006-01-01)

C22C13/00(2006-01-01)

(21) (22)

Application

2004103629/02, 2002-01-22

(24)

Start date

2002-01-22

(22)

Actual filing date

2002-01-22

(45)

Published

2006-01-20

(72)

Inventor

Chu Kaj KhuaPan Vej Chikh

(73)

Holder

Singapur Asakhi Kemikal Ehnd Solder Indastriz Pi-Ti-I Ltd.Kuontum Kemikal Teknolodzhiz S' Por Pi-Ti-I Ltd.

SOLDER PRACTICALLY WITHOUT LEAD, ITS PREPARATION METHOD Russian patent published in 2006 - IPC B23K35/26 C22C13/00

Abstract RU 2268126 C2

FIELD: solders, practically containing no lead.

SUBSTANCE: solder is prepared by mixing tin, silver, indium, copper and phosphorus. Such solder practically including no lead contains, %: tin, 91.39; silver, 4,1; indium, 4.0; copper, 0.5; phosphorus, 0.01 and it is designed for welding by solder wave.

EFFECT: simplified, rational welding process with use of solder according to invention.

4 cl, 13 dwg

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RU 2 268 126 C2

Authors

Chu Kaj Khua

Pan Vej Chikh

Dates

2006-01-20—Published

2002-01-22—Filed