FIELD: metallurgy.
SUBSTANCE: invention can be used for connection of dissimilar metals, particularly during products soldering, for which there are made great demands for physical-mechanical properties of soldered joint, operating under action of the increased pressure, temperatures and load impacts. Solder alloy on the copper basis is located between soldered parts, it is implemented heating up to the temperature 1200°C with a heating rate not less than 200°C/s and keeping at this temperature 1.5 s and following cooling. Soldering is implemented in vacuum not lower than 1-10-3 millimetres of mercury.
EFFECT: method provides increasing of soldered joints working capacity with keeping of high physical-mechanical properties of refractory metal.
3 ex
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