METHOD OF CERAMICS SOLDERING WITH METALS AND NONMETALS Russian patent published in 2008 - IPC B23K1/00 B23K1/19 B23K103/18 

FIELD: technological processes.

SUBSTANCE: invention may be used in electronic, radio engineering industry and precision instrument-making for soldering of items with high requirements of vacuum density, heat resistance, moisture resistance, corrosion resistance under influence of high pressures, high temperatures and impact loads. Solder that contains titanium is installed between connected surfaces. It is heated in vacuum to the temperature of solder melting and cooled down. Compound that contains lithium pentaborate is applied onto soldered joint. Repeated heating is performed in vacuum to the temperature of at least 850°C with delay of at least 2 minutes and further cooling down to room temperature. Repeated soldering provides for tight cohesion of soldered joint, metal and ceramics. Glassy film is produced on the surface of soldered joint during cooldown.

EFFECT: protection of joint against effect of high humidity and temperature.

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