FIELD: microstructure technologies.
SUBSTANCE: invention relates to micromechanical, micro-electromechanical component. Manufacturing method of micromechanical, micro-electromechanical or microoptical electromechanical component, according to which: it is manufactured the first lamellar composite material, allowing the first substratum (2) and the first insulating layer (3), which covers at last one part of surface (1) of the first substratum (2). It is manufactured the second lamellar composite material, containing the second substratum (12) and the second insulating layer (14), which covers at least one part of surface (13) of the second substratum (12). It is applied at least partly conductive structural layer (7) on the first insulating layer (3). It is applied the second composite material on structural layer (7), so that the second insulating layer (14) join to structural layer (7). Additionally the first and the second lamellar composite materials, and also structural layer (7) are configured so that at least one part of structural layer (7), which contains active region (8) of component, is hermetically insulated by the first and the second lamellar composite materials, and then it is formed in the first and/or the second substratum (2,12) contact openings(4) for providing of contact with conducting zones (9) of structural layer (7).
EFFECT: manufacturing of component, non requiring complex production technology, providing to reliably enclose into hermetic envelope corresponding active structures and to withdraw from component electric contacts.
19 cl, 10 dwg
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Authors
Dates
2009-10-27—Published
2006-04-03—Filed