FIELD: physics.
SUBSTANCE: invention relates to micro electromechanical and micro optoelectromechanical elements and to methods of their production. Proposed method comprises producing first package of layers including first substrate whereon first insulation layer is applied whereon at least partially conducting protective layer is applied, producing first and second recesses in said protective layer. Note here that first recesses etching depth exceeds that of second recesses and at least equals protective layer thickness. Now, partially conducting structural layer is applied on protective layer so that said structural layer adjoins at least several sections of protective layer.
EFFECT: components with intersecting inner connections, particularly, bridges above movable structures.
35 cl, 7 dwg
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