FIELD: electrical engineering.
SUBSTANCE: invention is intended for gang mechanical and/or electrical connection of functional devices arranged in different substrates operated at low temperatures. Proposed multi-contact hybrid connection comprises at least one flexible element. Contact element is arranged in independent contact connection rigidly jointed with substrates, apart from aforesaid flexible element. Said contact element represents two micro columns soldered together and made from conducting material or one micro column made from conducting material. Note here that said flexible element allows said contact element to move spatially and is arranged between contact element and one of substrates to be jointed together. Said micro column can be made from conducting material, for example In or Ga, or InSb, or ZnSn alloy. Flexible element can be connected with substrate via armature arranged on contact pad.
EFFECT: higher reliability of connection.
13 cl, 6 dwg
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Authors
Dates
2010-03-10—Published
2008-10-27—Filed