FIELD: electric engineering.
SUBSTANCE: device comprises cooling element, including group of semiconducting elements arranged with the possibility to generate thermoelectric Peltier effect as current is passed through it. Group of semiconductor elements is arranged with asymmetric shape in the third spatial dimension with creation of a fan-shaped element. Group of semiconducting elements is connected with development of a serial electric circuit with cooled element. Semiconductor elements may be arranged radially on circuit board. Thickness of semiconductor elements may vary in direction, which is perpendicular to circuit board plane, with creation of narrowing shape. In this case semiconducting elements mainly have wedge-like shape, besides sharpened or narrow end produces zone of cooling, and opposite wide end produces heating zone.
EFFECT: improved distribution of heat energy and heat transfer to heat removal radiator.
30 cl, 13 dwg
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