FIELD: process engineering.
SUBSTANCE: invention can be used for assembly/disassembly of SM components on one-side, double-side and multi-layer PCBs of radio electronic modules with the help of convective heating. Proposed method exploits air flow effects on component terminals in the following soldering conditions, i.e. temperature saturation, melting and cooling at different air temperature and airflow action duration. Note that melting conditions is realised by reducing and locking the distance between SM component and solder iron by hot air with the help of spring-loaded lever. Note also that required distance is set with the help of limiter with locking screw, bracket lever travel fine adjustment screw and measuring plate.
EFFECT: simplified process, reduced production costs.
2 cl, 1 dwg
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